|
Rigid PCB Feature
|
Mass production
|
Advanced
|
|
Layers
|
1 layer - 20 layers
|
1 layer - 26 layers
|
|
Max. copper thickness of inner layer (oz)
|
12
|
15
|
|
Max. copper thickness of outer layer (oz)
|
20
|
25
|
|
Min copper thickness (oz)
|
1/3
|
1/3
|
|
Min. via hole size (CNC Drilling) (mm)
|
0.2
|
0.1
|
|
Pad over drill size (inner layer) (mm)
|
0.125
|
0.1
|
|
Pad over drill size (outer Layer）(mm)
|
0.125
|
0.1
|
|
Max. aspect Ratio
|
10:1
|
12:1
|
|
Plated via hole diameter tolerance (mm)
|
±0.076
|
±0.05
|
|
Min width of solder mask dam (mm)
|
0.1
|
0.076
|
|
Solder Mask Registration Tolerance
|
0.076
|
0.05
|
|
Min. thickness of the core of multilayer PCB (mm)
|
0.1
|
0.1
|
|
Layer to layer registration tolerance (mm)
|
±0.1
|
±0.076
|
|
Max. unit size (mm)
|
550X620
400X1500
|
550X620
400X2000
|
|
Min. unit size (mm)
|
0.5x1
|
0.5x0.8
|
|
Max. board thickness (mm)
|
3.5
|
20
|
|
Min. board thickness (mm)
|
0.4
|
0.15
|
|
Impedance control tolerance
|
±10%
|
±8%
|
